HTCC and LTCC are ceramic substrate technologies used in high-density, high-reliability electronic packaging. MLCC refers to multilayer ceramic capacitors, which serve as capacitive components in electronic circuits.
Technical Parameters:
HTCC: Mesh count 120–180, maximum thickness 200μm, via accuracy ±5μm, aperture ratio 30%–35%
LTCC: Mesh count 120–220, maximum thickness 180μm, via accuracy ±4μm, aperture ratio 35%–40%
MLCC: Mesh count 250–350, maximum thickness 150μm, via accuracy ±2μm, aperture ratio 45%–50%
