Wafer bump printing stencils are core consumables in the Wafer Level Packaging (WLP) process, specially designed for solder paste printing on semiconductor chip bumps. Using high-precision stainless steel screens, solder paste (such as SAC305) is accurately transferred onto the wafer surface to form micro-scale metal bumps, which provide the foundation for chip‑substrate interconnection in the subsequent reflow soldering process.
Technical Parameters: Accuracy: ±2μm, Material thickness: 50μm, Bump size: 0.08–0.2mm.
