Please enter search keywords!

CN

COB / Wafer Level 3D SMD Steel Plate
Semiconductor/Pan Semiconductor Screen
COB / Wafer Level 3D SMD Steel Plate

It is a packaging form for electronic components. Thanks to their small size, light weight, high mounting density and strong vibration resistance, SMD components are widely used in consumer electronics, automotive electronics, industrial control and other fields.

Technical Parameters: Current maximum thickness: 45μm, punching accuracy: ±1.5μm, open area ratio: 30%–35%.

  • Hotline

    0512-57864816

  • Mail

    sales@hensun.com.cn

  • Address

    No. 2211 Beimen Road, Yushan Town, Kunshan City, Jiangsu Province

  • Social Media

Copyright © Kunshan Hensun Electronics Co., Ltd.. All rights reserved.

Sitemap | Legal Statement | Privacy Policy |