Its main function is to assist solder paste deposition by transferring an accurate volume of solder paste to precise positions on the PCB. Typically made of stainless steel, it features fine opening patterns to control the shape and volume of printed solder paste. Laser-cut stencils offer extremely high opening positioning accuracy, with a total error ≤ ±4μm.
Technical Parameters: Current maximum thickness: 200μm, via accuracy: ±4μm, aperture ratio: 35%–45%.
